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Articles

Pressure Sintering for High-Power Packaging

Pressure Sintering for High-Power Packaging

By Eric Kuah TH, Ding Jia Pei, D. Mouleeswaran, Richard Tang, Yuan Bin & Wilson Kwok

The rise in ECU usage in the modern internal combust ion engine ( ICE) and the growth of the EV automotive sector shows a broader trend of increasing amounts of electronics in each of these classes of automobiles.

In order for ECUs to be able to operate reliably, pressure sintering is used to create robust and reliable bonding between the semiconductor die and the substrate joined by the AgS material. Various steps of the sintering package assembly flow were described starting from printing, to final pressure sintering.


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